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Chip Industry Week in Review
1+ day, 17+ hour ago (454+ words) 12-inch high-NA EUV masks; Arm’s edge AI push; Amkor’s expansion; 3D memory; FeRAM startup makes waves; Qualcomm-AWS $60B custom silicon deal; Ayar Labs’ scale-up deal; new iPhone chip and format; rogue OpenAI agents in Germany; fab factory; fine-pitch RDL tech for advanced…...
Intel reports more than 1 million High-NA wafers—but stitching remains the hurdle
2+ day, 15+ hour ago (1013+ words) Intel reports more than 1 million High-NA wafers, but stitching and mask limits still shape the real manufacturing significance of the milestone. Intel reported in September 2026 that it had processed more than 1,000,000 300-mm wafers through High-NA EUV scanners. That is a…...
Zuken-TSMC Alliance Highlights Push Toward Integrated Chiplet Design Workflows
2+ day, 22+ hour ago (47+ words) openPR.com Zuken-TSMC Alliance Highlights Push Toward Integrated Chiplet Design Workflows Press release from: Factmr Permanent link to this press release: You can edit or delete your press release Zuken-TSMC Alliance Highlights Push Toward Integrated Chiplet Design Workflows here...
Clarkson helps tackle next-generation chip challenges
3+ day, 13+ hour ago (92+ words) nny360.com POTSDAM â As computer chips become smaller, more powerful and more complex, the scientists and engineers responsible for manufacturing them face an increasingly difficult challenge: developing processes precise enough to keep pace. The experts working at the forefront of…...
Silicon Labs launches Austin R&D center for chip innovation
3+ day, 21+ hour ago (332+ words) Bisinfotech The new research and development center has been officially launched by Silicon Labs at its Austin facility, which is considered to be an important milestone in chip design and wireless testing The expanded facilities will be used for testing…...
Microchip's 1.2V Clock Buffers Link Latest SoCs and FPGAs with Higher Voltage Components
3+ day, 20+ hour ago (612+ words) marketscreener.com...
KCC Researcher Wins Government Award for Chip Material Localization
4+ day, 8+ hour ago (161+ words) Kim Tae-yoon Recognized for Semiconductor Encapsulant Research Material Once Imported From Japan Entered Mass Production Last Year A semiconductor materials researcher at KCC (002380.KS) has received a government award for more than two decades of work on epoxy molding compound…...
ASML to partner with major chipmakers for next-generation tools for larger data center chips
4+ day, 10+ hour ago (389+ words) ANI 08 Sep 2026, 22:28 GMT+ New Delhi [India], September 8 (ANI): Dutch semiconductor equipment manufacturer ASML plans to collaborate with its major customers to deploy its most advanced tools for producing large data center chips designed by firms such as Nvidia, according to…...
TSMC and Samsung Commit to ASML High-NA EUV Machines for AI Chip Production: 11 outlets compared
4+ day, 8+ hour ago (456+ words) TSMC will deploy High-NA EUV machines starting 2030 Samsung aims adoption by 2030, with 12-inch mask transition by 2033 9 of 11 outlets skipped it: intel already processed over a million wafers using High-NA. Samsung and TSMC have committed to using ASML’s High-NA EUV lithography…...
Department of Commerce Announces Finalization of CHIPS R&D Award with D-Wave
4+ day, 22+ hour ago (111+ words) nist.gov Official websites use.gov Secure.gov websites use HTTPS Department of Commerce Announces Finalization of CHIPS R&D Award with D-Wave WASHINGTON, D.C. — The U.S. Department of Commerce announced today the signing of a final award of up to…...